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![]() Systine Inc. (UCLA) TOWARDS WAFER-SCALE MANUFACTURING OF NANODEVICES: MASSIVELY PARALLEL ETCHING OF NANOSTRUCTURE ARRAYS Devices with nanometer-scale features promise dramatic technological performance. Achieving this potential economically requires massively parallel nanofabrication methods, analogous to the lithography and etching techniques used in microfabrication. Systine has developed Low Energy Electron Enhanced Etching (LE4), which has etched structures as small as 5nm with high precision, atomically smooth surfaces, and no etch-induced damage. LE4, which operates in a DC plasma platform, has already been scaled up to process 4-inch wafers and can be easily scaled to larger wafer sizes as wafer-scale nano-patterning becomes available. |